Key Features
- Superior electrical and thermal performance thanks to the flip chip bonding technology.
Wide support from consumer appliances to high-end applications including servers. - Support for ultra multi-pin by arranging the chip electrode over an area.
- Good dissipation of heat produced from the high electric consumption chip by deployment of a heat spreader.
- Capable of reduction of waveform distortion and high speed transmission (GHz level) for high frequencies.
- Fully customizable according to the customer's requirements.
FC-BGA Package
FC-PBGA Package Cross Section
Middle to High-end Package Road Map
With our extensive implementation technologies, we will provide the most suitable SiP to meet the customer's requirements.
Please contact us for more information.
FC-BGA Package line-up
FC-PBGA
Pin count | Package size (mm) | Pin arrangement | Ball matrix | Pin pitch (mm) | |
---|---|---|---|---|---|
X | Y | ||||
BGA484 | 23.0 | 23.0 | Full Matrix | 22 × 22 | 1.00 |
BGA592 | 21.0 | 21.0 | Full Matrix (With nonexistent pins) |
25 × 25 | 0.80 |
BGA625 | 17.0 | 17.0 | Full Matrix | 25 × 25 | 0.65 |
BGA625 | 27.0 | 27.0 | Full Matrix | 25 × 25 | 1.00 |
BGA729 | 29.0 | 29.0 | Full Matrix | 27 × 27 | 1.00 |
BGA900 | 31.0 | 31.0 | Full Matrix | 30 × 30 | 1.00 |
BGA1020 | 33.0 | 33.0 | Full Matrix | 32 × 32 | 1.00 |
BGA1156 | 35.0 | 35.0 | Full Matrix | 34 × 34 | 1.00 |
BGA1206 | 37.5 | 37.5 | Full Matrix (With nonexistent pins) |
36 × 36 | 1.00 |
BGA1396 | 37.5 | 37.5 | Full Matrix | 37 × 37 | 1.00 |
BGA1681 | 42.5 | 42.5 | Full Matrix | 41 × 41 | 1.00 |
FC-CBGA
Pin count | Package size (mm) | Pin arrangement | Ball matrix | Pin pitch (mm) | |
---|---|---|---|---|---|
X | Y | ||||
BGA625 | 27.0 | 27.0 | Full Matrix | 25 × 25 | 1.00 |
BGA625 | 33.0 | 33.0 | Full Matrix | 25 × 25 | 1.27 |
BGA729 | 35.0 | 35.0 | Full Matrix | 27 × 27 | 1.27 |
BGA900 | 31.0 | 31.0 | Full Matrix | 30 × 30 | 1.00 |
BGA900 | 40.0 | 40.0 | Full Matrix | 30 × 30 | 1.27 |
BGA1089 | 42.5 | 42.5 | Full Matrix | 33 × 33 | 1.27 |
BGA1156 | 35.0 | 35.0 | Full Matrix | 34 × 34 | 1.00 |
BGA1225 | 45.0 | 45.0 | Full Matrix | 35 × 35 | 1.27 |
BGA1369 | 37.5 | 37.5 | Full Matrix | 37 × 37 | 1.00 |
BGA1681 | 42.5 | 42.5 | Full Matrix | 41 × 41 | 1.00 |
BGA2116 | 47.5 | 47.5 | Full Matrix | 46 × 46 | 1.00 |
Please contact us for information on other pin arrangements.